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Pressure
Freescale Semiconductor Integrated Silicon Pressure Sensor On-Chip Signal Conditioned, Temperature Compensated and Calibrated
The MPX5100 series piezoresistive transducer is a state-of-the-art monolithic silicon pressure sensor designed for a wide range of applications, but particularly those employing a microcontroller or microprocessor with A/D inputs. This patented, single element transducer combines advanced micromachining techniques, thin-film metallization, and bipolar processing to provide an accurate, high level analog output signal that is proportional to the applied pressure.
MPX5100 Rev 13, 05/2010
MPX5100 MPXV5100 Series
0 to 100 kPa (0 to 14.5 psi) 15 to 115 kPa (2.2 to 16.7 psi) 0.2 to 4.7 V Output
Typical Applications
* * * * Patient Monitoring Process Control Pump/Motor Control Pressure Switching
Features
* * * * * * 2.5% Maximum Error over 0 to 85C Ideally suited for Microprocessor or Microcontroller-Based Systems Patented Silicon Shear Stress Strain Gauge Available in Absolute, Differential and Gauge Configuration Durable Epoxy Unibody Element Easy-to-Use Chip Carrier Option ORDERING INFORMATION
Case Device Name No. Unibody Package (MPX5100 Series) None # of Ports Single Dual Gauge
Pressure Type Differential
Absolute * *
Device Marking MPX5100A MPX5100AP MPX5100D MPX5100DP MPX5100GP MPXV5100G MPXV5100G MPXV5100DP MPXV5100GP
MPX5100A 867 * MPX5100AP 867B MPX5100D 867 * MPX5100DP 867C MPX5100GP 867B Small Outline Package (MPXV5100 Series) MPXV5100GC6U MPXV5100GC7U MPXV5100DP MPXV5100GP 482A 482C 1351 1369
* * * * * * * * * * * * * *
(c) Freescale Semiconductor, Inc., 2005-2010. All rights reserved.
Pressure
UNIBODY PACKAGES
MPX5100A/D CASE 867-08
MPX5100AP/GP CASE 867B-04
MPX5100DP CASE 857C-05
SMALL OUTLINE PACKAGES
MPXV5100GC6U CASE 482A-01
MPXV5100GC7U CASE 482C-03
MPXV5100DP CASE 1351-01
MPXV5100GP CASE 1369-01
MPX5100 2 Sensors Freescale Semiconductor
Pressure
Operating Characteristics
Table 1. Operating Characteristics (VS = 5.0 Vdc, TA = 25C unless otherwise noted, P1 > P2. Decoupling circuit shown in Figure 5 required to meet electrical specifications.)
Characteristic Pressure Range(1) Gauge, Differential: MPX5100D/MPX5100G/MPXV5100G Absolute: MPX5100A Supply Voltage(2) Supply Current Minimum Pressure Offset(3) @ VS = 5.0 V Full Scale Output(4) @ VS = 5.0 V Full Scale Span(5) @ VS = 5.0 V Accuracy(6) Sensitivity Response Time(7) Output Source Current at Full Scale Output Warm-Up Time(8) Offset Stability(9) 1. 1.0 kPa (kiloPascal) equals 0.145 psi. 2. 3. 4. 5. 6. Device is ratiometric within this specified excitation range. Offset (VOFF) is defined as the output voltage at the minimum rated pressure. Full Scale Output (VFSO) is defined as the output voltage at the maximum or full rated pressure. Full Scale Span (VFSS) is defined as the algebraic difference between the output voltage at full rated pressure and the output voltage at the minimum rated pressure. Accuracy (error budget) consists of the following: * Linearity: Output deviation from a straight line relationship with pressure over the specified pressure range. * Temperature Hysteresis:Output deviation at any temperature within the operating temperature range, after the temperature is cycled to and from the minimum or maximum operating temperature points, with zero differential pressure applied. * Pressure Hysteresis: Output deviation at any pressure within the specified range, when this pressure is cycled to and from minimum or maximum rated pressure at 25C. * TcSpan: Output deviation over the temperature range of 0 to 85C, relative to 25C. * TcOffset: Output deviation with minimum pressure applied over the temperature range of 0 to 85C, relative to 25C. * Variation from Nominal: The variation from nominal values, for Offset or Full Scale Span, as a percent of VFSS at 25C. Response Time is defined as the time for the incremental changed in the output to go from 10% to 90% of its final value when subjected to a specified step change in pressure. Warm-Up Time is defined as the time required for the product to meet the specified output voltage after the Pressure has been stabilized. Offset Stability is the product's output deviation when subjected to 1000 hours of Pulsed Pressure, Temperature Cycling with Bias Test. (0 to 85C) Symbol POP 0 15 VS IO VOFF VFSO VFSS -- V/P tR IO+ -- -- 4.75 -- 0.088 -- -- 5.0 7.0 0.20 100 115 5.25 10 0.313 VDC mAdc VDC VDC VDC %VFSS mV/kPa ms mAdc ms %VFSS Min Typ Max Unit kPa
Differential and Absolute (0 to 85C)
4.587
4.700
4.813
Differential and Absolute (0 to 85C)
--
4.500
--
-- -- -- -- -- --
-- 45 1.0 0.1 20 0.5
2.5 -- -- -- -- --
7. 8. 9.
MPX5100 Sensors Freescale Semiconductor 3
Pressure
Maximum Ratings
Table 2. Maximum Ratings(1)
Rating Maximum Pressure (P1 > P2) Storage Temperature Operating Temperature Symbol Pmax Tstg TA Value 400 -40 to +125 -40 to +125 Unit kPa C C
1.Exposure beyond the specified limits may cause permanent damage or degradation to the device.
Figure 1 shows a block diagram of the internal circuitry integrated on a pressure sensor chip in a Unibody Package.
VS 3
Sensing Element
Thin Film Temperature Compensation and Gain Stage #1
Gain Stage #2 and Ground Reference Shift Circuitry
Vout 1
2 GND
Pins 4, 5, and 6 are NO CONNECTS.
Figure 1. Fully Integrated Pressure Sensor Schematic for Unibody Package Devices Figure 2 shows a block diagram of the internal circuitry integrated on a pressure sensor chip in a Small Outline Package.
VS 2
Sensing Element
Thin Film Temperature Compensation and Gain Stage #1
Gain Stage #2 and Ground Reference Shift Circuitry
Vout 4
3 GND
Pins 1 and 5-8 are NO CONNECTS.
Figure 2. Fully Integrated Pressure Sensor Schematic for Small Outline Package Devices
MPX5100 4 Sensors Freescale Semiconductor
Pressure
On-chip Temperature Compensation and Calibration
Figure 3 shows the sensor output signal relative to pressure input. Typical, minimum, and maximum output curves are shown for operation over a temperature range of 0 to 85C using the decoupling circuit shown in Figure 5. The output will saturate outside of the specified pressure range. Figure 4 illustrates both the Differential/Gauge and the Absolute Sensing Chip in the basic chip carrier (Case 867). A fluorosilicone gel isolates the die surface and wire bonds from
5 4 Output Voltage (V) 3 2 1 0
the environment, while allowing the pressure signal to be transmitted to the sensor diaphragm. The MPX5100 series pressure sensor operating characteristics, and internal reliability and qualification tests are based on use of dry air as the pressure media. Media, other than dry air, may have adverse effects on sensor performance and long-term reliability. Contact the factory for information regarding media compatibility in your application.
Span Range (Typ) 100 110 90
Vout = VS*(0.009*P+0.04) (Pressure Error * Temperature Factor * 0.009 * VS) VS = 5.0 V 0.25 Vdc PE = 2.5 TM = 1 TEMP = 0 to 85C
MAX TYP MIN 10 20 30 40 50 60 70 80
0
Pressure (kPa)
(Typ) Offset
Figure 3. Output vs. Pressure Differential
Fluorosilicone Gel Die Coat Wire Bond
Die
Stainless Steel Metal Cover Epoxy Plastic Case Wire Bond
Fluorosilicone Gel Die Coat Die
Output Range (Typ)
Stainless Steel Metal Cover Epoxy Plastic Case
Lead Frame
Differential/Gauge Element
Die Bond
Lead Frame
Absolute Element
Die Bond
Figure 4. Cross Sectional Diagrams (not to scale) Figure 5 shows the recommended decoupling circuit for interfacing the output of the integrated sensor to the A/D input of a microprocessor or microcontroller. Proper decoupling of the power supply is recommended.
+5.0 V
VOUT Vs IPS 1.0 F 0.01 F GND
OUTPUT
470 pF
Figure 5. Recommended Power Supply Decoupling and Output Filtering (For additional output filtering, please refer to Application Note AN1646.)
MPX5100 Sensors Freescale Semiconductor 5
Pressure
Transfer Function (MPX5100D, MPX5100G, MPXV5100G Nominal Transfer Value: VOUT = VS (P x 0.009 + 0.04)
(Pressure Error x Temp. Mult. x 0.009 x VS) VS = 5.0 V 0.25 V
Temperature Error Multiplier MPX5100D/MPX5100G/MPXV5100G Series
Break Points 4.0 3.0 2.0 1.0 0.0 -40 -20 0 20 40 60 Temperature in C 80 100 120 140 Temp - 40 0 to 85C +125 Multiplier 3 1 3
Note: The Temperature Multiplier is a linear response from 0 to -40C and from 85 to 125C.
Pressure Error Band
3.0 2.0 Error (kPa) 1.0 0.0 -1.0 -2.0 -3.0
MPX5100D/MPX5100G/MPXV5100G Series
Error Limits for Pressure
0
20
40
60
80
100
120
Pressure in kPa
Pressure 0 to 100 kPa
Error (max) 2.5 kPa
MPX5100 6 Sensors Freescale Semiconductor
Pressure
Transfer Function (MPX5100A) Nominal Transfer Value: VOUT = VS (P x 0.009 - 0.095)
(Pressure Error x Temp. Mult. x 0.009 x VS) VS = 5.0 V 0.25 V
Temperature Error Multiplier MPX5100A Series
Break Points Temp Multiplier - 40 0 to 85C +125 3 1 3
4.0 3.0 2.0 1.0 0.0 -40 -20 0
20
40
60
80
100
120
130
140
Temperature in C Note: The Temperature Multiplier is a linear response from 0 to -40C and from 85 to 125C.
Pressure Error Band MPX5100A Series
3.0 2.0 Error (kPa) 1.0 0.0 -1.0 -2.0 -3.0 Pressure 15 to 115 kPa Error (max) 2.5 kPa 0 20 40 60 80 100 130 Pressure in kPa Error Limits for Pressure
MPX5100 Sensors Freescale Semiconductor 7
Pressure
PRESSURE (P1)/VACUUM (P2) SIDE IDENTIFICATION TABLE
Freescale designates the two sides of the pressure sensor as the Pressure (P1) side and the Vacuum (P2) side. The Pressure (P1) side is the side containing fluoro silicone gel which protects the die from harsh media. The MPX pressure
Part Number MPX5100A, MPX5100D MPX5100DP MPX5100AP, MPX5100GP MPXV5100GC6U MPXV5100GC7U MPXV5100DP MPXV5100GP
sensor is designed to operate with positive differential pressure applied, P1 > P2. The Pressure (P1) side may be identified by using the table below.
Case Type 867 867C 867B 482A 482C 1351 1369 Pressure (P1) Side Identifier Stainless Steel Cap Side with Part Marking Side with Port Attached Side with Port Attached Side with Port Attached Side with Part Marking Side with Port Attached
SURFACE MOUNTING INFORMATION
Minimum Recommended Footprint for Surface Mounted Applications Surface mount board layout is a critical portion of the total footprint, the packages will self align when subjected to a design. The footprint for the surface mount packages must be solder reflow process. It is always recommended to design the correct size to ensure proper solder connection interface boards with a solder mask layer to avoid bridging and between the board and the package. With the correct shorting between solder
Figure 6. Small Outline Package Footprint
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PACKAGE DIMENSIONS
-A-
5 4
D 8 PL 0.25 (0.010)
M
TB
S
A
S
N -B-
8
G
1
NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. 3. DIMENSION A AND B DO NOT INCLUDE MOLD PROTRUSION. 4. MAXIMUM MOLD PROTRUSION 0.15 (0.006). 5. ALL VERTICAL SURFACES 5 TYPICAL DRAFT. DIM A B C D G H J K M N S V W INCHES MIN MAX 0.415 0.425 0.415 0.425 0.500 0.520 0.038 0.042 0.100 BSC 0.002 0.010 0.009 0.011 0.061 0.071 0 7 0.444 0.448 0.709 0.725 0.245 0.255 0.115 0.125 MILLIMETERS MIN MAX 10.54 10.79 10.54 10.79 12.70 13.21 0.96 1.07 2.54 BSC 0.05 0.25 0.23 0.28 1.55 1.80 0 7 11.28 11.38 18.01 18.41 6.22 6.48 2.92 3.17
S
W
V C J K M
PIN 1 IDENTIFIER
H -T-
SEATING PLANE
CASE 482A-01 ISSUE A SMALL OUTLINE PACKAGE
-A4 5
N
-BG
8 1
0.25 (0.010)
M
TB
D 8 PL S A
NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. 3. DIMENSION A AND B DO NOT INCLUDE MOLD PROTRUSION. 4. MAXIMUM MOLD PROTRUSION 0.15 (0.006). 5. ALL VERTICAL SURFACES 5 TYPICAL DRAFT. 6. DIMENSION S TO CENTER OF LEAD WHEN FORMED PARALLEL.
S DIM A B C D G J K M N S V W SEATING PLANE INCHES MILLIMETERS MAX MAX MIN MIN 10.79 0.425 10.54 0.415 10.79 0.425 10.54 0.415 13.21 0.520 12.70 0.500 0.864 0.66 0.034 0.026 0.100 BSC 2.54 BSC 0.28 0.23 0.011 0.009 3.05 2.54 0.120 0.100 15 0 15 0 11.38 0.448 11.28 0.444 14.22 0.560 13.72 0.540 6.48 6.22 0.255 0.245 3.17 2.92 0.125 0.115
DETAIL X S W
V C
PIN 1 IDENTIFIER
-TK M J DETAIL X
CASE 482C-03 ISSUE B SMALL OUTLINE PACKAGE
MPX5100 Sensors Freescale Semiconductor 9
Pressure
NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. DIM A B C D F G J K L N P Q R S U V W X INCHES MIN MAX 1.145 1.175 0.685 0.715 0.405 0.435 0.027 0.033 0.048 0.064 0.100 BSC 0.014 0.016 0.695 0.725 0.290 0.300 0.420 0.440 0.153 0.159 0.153 0.159 0.063 0.083 0.220 0.240 0.910 BSC 0.182 0.194 0.310 0.330 0.248 0.278 STYLE 1: PIN 1. 2. 3. 4. 5. 6. MILLIMETERS MIN MAX 29.08 29.85 17.40 18.16 10.29 11.05 0.68 0.84 1.22 1.63 2.54 BSC 0.36 0.41 17.65 18.42 7.37 7.62 10.67 11.18 3.89 4.04 3.89 4.04 1.60 2.11 5.59 6.10 23.11 BSC 4.62 4.93 7.87 8.38 6.30 7.06
P 0.25 (0.010) X R
PORT #1 POSITIVE PRESSURE (P1) PORT #2 VACUUM (P2)
M
TQ
M
-A- U W L V
PORT #2 VACUUM (P2) PORT #1 POSITIVE PRESSURE (P1)
N
-Q- B
PIN 1
1
2
3
4
5
6
K S
C
SEATING PLANE
-T-
-T- J
SEATING PLANE
G F
D 6 PL 0.13 (0.005)
M
A
M
VOUT GROUND VCC V1 V2 VEX
CASE 867-08 ISSUE N UNIBODY PACKAGE
C R M B -AN
PIN 1 SEATING PLANE
1 2 3 4 5 6
POSITIVE PRESSURE (P1)
NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. 3. DIMENSION -A- IS INCLUSIVE OF THE MOLD STOP RING. MOLD STOP RING NOT TO EXCEED 16.00 (0.630).
INCHES MILLIMETERS MAX MIN MAX MIN 16.00 0.595 0.630 15.11 13.56 0.514 0.534 13.06 5.59 0.200 0.220 5.08 0.84 0.027 0.033 0.68 1.63 0.048 0.064 1.22 0.100 BSC 2.54 BSC 0.40 0.014 0.016 0.36 18.42 0.695 0.725 17.65 30 NOM 30 NOM 12.57 0.475 0.495 12.07 11.43 0.430 0.450 10.92 0.090 0.105 2.29 2.66
L
-TG F D 6 PL 0.136 (0.005)
M
J S
TA
M
DIM A B C D F G J L M N R S OPEN GROUND +VOUT +VSUPPLY -VOUT OPEN
STYLE 1: PIN 1. 2. 3. 4. 5. 6.
VOUT GROUND VCC V1 V2 VEX
STYLE 2: PIN 1. 2. 3. 4. 5. 6.
OPEN GROUND -VOUT VSUPPLY +VOUT OPEN
STYLE 3: PIN 1. 2. 3. 4. 5. 6.
CASE 867C-05 ISSUE F UNIBODY PACKAGE
MPX5100 10 Sensors Freescale Semiconductor
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CASE 867B-04 ISSUE G UNIBODY PACKAGE
MPX5100 Sensors Freescale Semiconductor 11
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CASE 867B-04 ISSUE G UNIBODY PACKAGE
MPX5100 12 Sensors Freescale Semiconductor
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PACKAGE DIMENSIONS
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CASE 1351-01 ISSUE A SMALL OUTLINE PACKAGE
MPX5100 Sensors Freescale Semiconductor 13
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CASE 1351-01 ISSUE A SMALL OUTLINE PACKAGE
MPX5100 14 Sensors Freescale Semiconductor
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PACKAGE DIMENSIONS
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CASE 1369-01 ISSUE B SMALL OUTLINE PACKAGE
MPX5100 Sensors Freescale Semiconductor 15
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CASE 1369-01 ISSUE B SMALL OUTLINE PACKAGE
MPX5100 16 Sensors Freescale Semiconductor
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MPX5100 Rev. 13 05/2010

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